礦ision Build Log

Tool Versions:

IDE-Version: μVision V5.21.1.0 Copyright (C) 2016 ARM Ltd and ARM Germany GmbH. All rights reserved. License Information: 123 123, 123, LIC=03C74-FG5EU-KPHZY-IQGM5-7UGXM-6G49T Tool Versions: Toolchain: MDK-ARM Plus Version: 5.21a Toolchain Path: D:\ARM\ARMCC\Bin C Compiler: Armcc.exe V5.06 update 3 (build 300) Assembler: Armasm.exe V5.06 update 3 (build 300) Linker/Locator: ArmLink.exe V5.06 update 3 (build 300) Library Manager: ArmAr.exe V5.06 update 3 (build 300) Hex Converter: FromElf.exe V5.06 update 3 (build 300) CPU DLL: SARMCM3.DLL V5.21a Dialog DLL: DCM.DLL V1.13.8.0 Target DLL: STLink\ST-LINKIII-KEIL_SWO.dll V2.0.18.0 Dialog DLL: TCM.DLL V1.14.14.0

Project:

E:\桌面\1.3OLED HAT\13OLED_demo\SPI例程\STM32例程\USER\OLED.uvprojx Project File Date: 05/28/2019

Output:

*** Using Compiler 'V5.06 update 3 (build 300)', folder: 'D:\ARM\ARMCC\Bin' Build target 'Target 1' compiling main.c... linking... Program Size: Code=3980 RO-data=8032 RW-data=2080 ZI-data=2984 FromELF: creating hex file... "..\OBJ\OLED.axf" - 0 Error(s), 0 Warning(s).

Collection of Component include folders:

E:\桌面\1.3OLED HAT\13OLED_demo\SPI例程\STM32例程\USER\RTE D:\Keil\STM32F1xx_DFP\2.4.1\Device\Include

Collection of Component Files used:

Build Time Elapsed: 00:00:01